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TSMC to Open Japan’s Most Advanced Semiconductor Production Facility in February

Last Updated on 02nd January 2024

TSMC will open its first semiconductor fabrication plant in Japan on February 24, 2024. The facility will utilize TSMC’s N28 (28nm-class) technologies to manufacture microchips. TSMC’s Japanese semiconductor factory is located near Kumamoto, a city on the Japanese island of Kyushu. The semiconductor fabrication unit will employ approximately 1,700 people once it is fully operational.


TSMC to Open Japan’s Most Advanced Semiconductor Production Facility in February


TSMC will probably host a formal opening ceremony on February 24, and the semiconductor fabrication plant will start producing chips in the second half of 2024.  The facility is set to process wafers using a variety of production nodes derived from the company’s N28 (28nm-class) technology.


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The production node includes several N28 variants and the 22ULP fabrication process, a specialty node for ultra-low-power applications. This technology is actively used in the automotive and consumer electronics sectors. There remains a lot of demand for such processors in Japan.


Read: TSMC Plans to Build a $20 Billion Microchip Plant with Cutting-Edge 3nm Tech in Kumamoto, Japan


About TSMC



Taiwan Semiconductor Manufacturing Company Limited (TSMC) is a Taiwanese multinational semiconductor contract manufacturing and design company.


TSMC is the world's largest dedicated independent semiconductor manufacturer with headquarters and main operations located in the Hsinchu Science Park in Hsinchu, Taiwan. Some of the upcoming projects executed by TSMC include:


Arizona Semiconductor Fabrication Plant

TSMC's first US factory is currently under construction in Phoenix, Arizona. It's expected to start producing 5nm chips in 2024 and 3nm chips in 2026. This $12 billion project will create thousands of jobs and boost TSMC's capacity to serve its North American customers.


Singapore Semiconductor Fabrication Plant

TSMC is also expanding its capacity in Singapore with a new fab that will focus on specialty technologies like RF chips and 3D sensors. This project is part of TSMC's broader strategy to diversify its manufacturing footprint and cater to the growing demand for these technologies.


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