Samsung Electronics plans to invest around USD 280 million to build an advanced chip packaging research facility in Japan. Japan’s industry ministry stated that it would provide Samsung subsidies worth up to USD 140 million. 

In March, it was reported that Samsung was seeking to establish a packaging facility in Kanagawa Prefecture. Where the company already has a research and development center.

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Samsung will be able to strengthen its semiconductor leadership and form strategic alliances with Yokohama-based packaging companies at the facility. 

A year ago, the chip manufacturer initiated efforts to strengthen its advanced chip packaging division. Businesses are competing to develop innovative packaging techniques that combine components into a single package.

Dr. Kye Hyun Kyung, the head of the Samsung Electronics Device Solutions Division, stated that the Japanese facility will allow Samsung to strengthen its leadership in chips and partner with packaging-related companies based in Yokohama.

Apart from this, Samsung recently signed a deal with ASML to develop a USD 760 million semiconductor plant in South Korea.

What is advanced packaging technology?

An advanced packaging facility is a specialized factory that uses cutting-edge techniques to assemble complex electronic devices, primarily semiconductors. Advanced packaging facilities play a crucial role in the semiconductor industry, enabling the development of next-generation electronic devices for diverse applications, from high-performance computing and artificial intelligence to mobile devices and wearable electronics.

About Samsung Electronics

Samsung Electronics is a South Korean multinational electronics company headquartered in Suwon, South Korea. It is the world's largest manufacturer of semiconductors and smartphones, and it consistently ranks among the top global brands. Samsung Electronics has many projects under its pipeline, such as:

• Taylor, Texas, USA 
• Pyeongtaek, South Korea
• Hwaseong, South Korea

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