PM Modi laid the foundation stone for three semiconductor projects worth about USD 15 billion (INR 1.25 lakh crores) during the ‘India’s Techade: Chips for Viksit Bharat’ program. These projects include the semiconductor fabrication facility at the Dholera Special Investment Region (DSIR), Gujarat; an Outsourced Semiconductor Assembly and Test (OSAT) facility in Morigaon, Assam; and another OSAT facility in Sanand, Gujarat.

Tata Electronics Private Limited (TEPL) will establish the semiconductor fabrication facility at the Dholera Special Investment Region (DSIR) with a total investment of over USD 11 billion (INR 91,000 crore). This will be the first commercial semiconductor factory in the country.

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Tata Electronics Private Limited (TEPL) will establish the OSAT facility in Morigaon, Assam, with a total investment of about USD 3.25 billion (INR 27,000 crore).

CG Power and Industrial Solutions Limited will establish the OSAT facility in Sanand with a total investment of about USD 905 million (INR 7,500 crore).

Addressing the occasion, the Prime Minister said that today’s historic occasion is a significant step towards a bright future for India. "Today’s projects will play a key role in making India a semiconductor hub," PM Modi said.

The Prime Minister emphasized that domestically produced and designed chips will play a significant role in advancing India towards self-reliance and modernization. PM Modi's statement was in line with the government's announcement of the National Semiconductor Mission two years ago, which has now culminated in the laying of foundation stones for three projects. 

Details About  Tata’s Semiconductor Fabrication Facility in Dholera

Tata Electronics Private Limited (TEPL), a wholly-owned subsidiary of Tata Sons Pvt. Ltd., is set to establish a semiconductor fabrication facility at the Dholera Special Investment Region (DSIR) in Gujarat, India. This initiative is a significant step towards creating an indigenous semiconductor ecosystem in India.

The facility is being built in partnership with Taiwan's Powerchip Semiconductor Manufacturing Corporation (PSMC). PSMC will provide technology and execution support for this state-of-the-art greenfield facility. The Fab will be AI-enabled and will include next-generation factory automation capabilities, deploying data analytics and machine learning to achieve industry-best factory efficiency.

The construction of the Fab will commence this year with a total investment of up to INR 91,000 crores (~US$11bn). It is expected to generate over 20,000 direct and indirect skilled jobs in the region. The Fab will have a manufacturing capacity of up to 50,000 wafers per month.

The new semiconductor fab will manufacture chips for applications such as power management ICs, display drivers, microcontrollers (MCUs), and high-performance computing logic. 

These chips will address the growing demand in markets such as automotive, computing and data storage, wireless communication, and artificial intelligence.

The establishment of this fab marks India's entry into the global semiconductor industry. By 2030, the global semiconductor industry is expected to grow to US$ 1 trillion, and Indian semiconductor demand is expected to cross US$110 billion. This initiative will significantly de-risk global supply chains and make India a very important player in the global semiconductor industry.

Details About  Tata’s OSAT Facility in Assam

The establishment of this OSAT facility is a significant step towards strengthening the semiconductor ecosystem in India. It will provide employment opportunities for youth in the semiconductor industry and catalyze employment generation in related sectors like electronics and telecom.

The OSAT facility will be responsible for the assembly, testing, marking, and packaging of semiconductors. These are crucial steps in the semiconductor manufacturing process, ensuring that the chips are correctly assembled, function as intended, and are properly packaged for distribution.

N. Chandrasekaran, Chairman of Tata Sons, made the announcement regarding the OSAT facility at the 'India's Techade: Chips for Viksit Bharat' event. Prime Minister Narendra Modi laid the foundation stone for this facility on March 13, 2024.

In conclusion, the establishment of the OSAT facility by TEPL in Morigaon, Assam, is a landmark initiative that will boost India's technological capabilities, create employment opportunities, and position India as a key player in the global semiconductor industry.

Details About CG Powers OSAT Facility in Gujarat

CG Power and Industrial Solutions Limited (CG), a part of Tube Investments of India Limited and the Murugappa Group, is set to establish an Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat. This initiative is part of India's vision to become a global hub for semiconductor design, manufacturing, and technology development.

The establishment of this OSAT facility is a significant step towards strengthening the semiconductor ecosystem in India. It will provide employment opportunities for youth in the semiconductor industry and catalyze employment generation in related sectors like electronics and telecom.

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The OSAT facility will be responsible for the assembly, testing, marking, and packaging of semiconductors. These are crucial steps in the semiconductor manufacturing process, ensuring that the chips are correctly assembled, function as intended, and are properly packaged for distribution.

Mr. S. Vellayan, Chairman of CG Power and Industrial Solutions Limited, announced the OSAT facility. Prime Minister Narendra Modi laid the foundation stone for this facility on March 13, 2024.

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