Announced at GTC Berlin on October 21, 2026, NVIDIA has unveiled a sweeping set of capacity agreements with six manufacturing partners, Amkor Technology, IBIDEN, King Yuan Electronics (KYEC), Samsung Electro-Mechanics, Siliconware Precision Industries (SPIL), and Unimicron Technology Corporation, designed to expand critical manufacturing capabilities across substrates, advanced packaging, semiconductor testing, and optical engines.

Demand Extraordinary, Capacity the Constraint

The announcement comes as NVIDIA scales production of its accelerated computing and full-stack AI factory platform. "We are in the midst of the largest infrastructure buildout in human history. Demand is extraordinary. Capacity is the constraint," said Jensen Huang, founder and CEO of NVIDIA, in the announcement.

"Our supply chain partners are the world's best manufacturers. I'm grateful they are expanding capacity around the globe to scale production and help us deliver the AI supercomputing systems powering this new industrial revolution."

Beyond volume growth, the agreements are intended to strengthen the resiliency and redundancy of NVIDIA's global supply chain, enabling both new and existing suppliers to broaden their manufacturing capabilities.

Substrate Capacity to Grow 2.5x Over Three Years

A central pillar of the plan is a 2.5x increase in substrate capacity for NVIDIA's products over the next three years, driven by agreements with three suppliers, with more underway.

Under an agreement signed and announced earlier this year, NVIDIA is providing a multibillion-dollar capacity reservation advance to support IBIDEN's Ono Plant in Japan. That expansion targets capacity reaching 3x current levels at the plant, with additional capacity expected to begin ramping in the first quarter of 2028.

Samsung Electro-Mechanics is joining NVIDIA's substrate supply chain, bringing immediate capacity from its existing operations in South Korea. The collaboration also supports facility upgrades and new factories in Sejong and Busan, South Korea. By 2028, production allocated to NVIDIA is projected to account for a significant portion of Samsung Electro-Mechanics' total annual package substrate production capacity.

In Taiwan, NVIDIA is supporting Unimicron's KF substrate manufacturing expansion through a capacity reservation agreement. That expansion is expected to begin adding capacity in the second quarter of 2027 and reach full capacity by mid-2028.

Advanced Packaging Expansion in South Korea

NVIDIA and Amkor plan to expand advanced packaging capacity in South Korea, targeting a greater than 300% increase in interposer wafer capacity by the end of 2028.

The planned expansion, alongside Amkor's development of new manufacturing facilities in South Korea, will support higher production volumes for NVIDIA's current and next-generation platforms.

Testing Capacity to Double, With New U.S. Facilities

NVIDIA expects its total semiconductor testing capacity to double from calendar 2026 to 2027, supported by buildouts in the United States, Taiwan, and Singapore.

A key element of the U.S. expansion is NVIDIA's USD 1.1 billion capacity reservation advance to KYEC, which will support new U.S. testing facilities and equipment, with high-volume production targeted for April 2027. In Singapore, expanded testing operations are expected to begin high-volume production in February 2027.

Co-Packaged Optics Capacity Targeted for 15x Growth

To support the growing connectivity requirements of large-scale computing infrastructure, NVIDIA and SPIL plan to expand manufacturing capacity in Taiwan for optical engines used in co-packaged optics. The expansion targets an increase of 15x by mid-2027, with aims for another doubling by the end of 2028.

A Global Manufacturing Push

Taken together, the agreements span manufacturing sites in Japan, South Korea, Taiwan, Singapore, and the United States, covering the full range of NVIDIA's critical production inputs: package substrates from IBIDEN, Samsung Electro-Mechanics, and Unimicron; interposer wafer packaging from Amkor; testing from KYEC and other buildout locations; and co-packaged optics from SPIL.

NVIDIA states that the combined efforts are intended to meet growing demand for its accelerated computing and AI factory platform while reinforcing the redundancy of its supply network.

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