GlobalFoundries and TSMC Strike $2 Billion Deal to make Silicon Interposers in the US

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GlobalFoundries and TSMC Strike $2 Billion Deal to make Silicon Interposers in the US

Updated on Oct 09, 2026, 11:11 AM IST
Written & Edited by Ashish

GlobalFoundries has announced a multi-year USD 2 billion manufacturing agreement with TSMC to establish a U.S.-based supply of silicon interposers for TSMC's CoWoS advanced packaging ecosystem, marking what the company describes as the first domestic source of these components for advanced packaging technologies.

Under the agreement, announced from Malta, New York, GlobalFoundries will provide manufacturing services to TSMC and add fabrication capacity at its Malta facility. The deal supports growing demand for high-performance computing and AI systems, and provides a foundation to expand capacity over time as customer demand grows.

Expanding the Malta site

GlobalFoundries expects to expand capacity at its Malta facility and establish the first U.S.-based source of silicon interposers supporting advanced packaging technologies, including embedded deep trench capacitor components.

 

The additional manufacturing capacity, according to the company, will provide greater scale and flexibility for delivering advanced packaging solutions across multiple product generations.

Volume production is expected to begin ramping at the Malta site during the first half of 2028. The agreement carries an initial term of five years and provides a framework for future capacity expansion.

 

Strategic Framing

"Advanced packaging is becoming increasingly critical to delivering the performance, power efficiency and scale required for next-generation AI systems," said Ed Kaste, senior vice president of CMOS Business at GlobalFoundries.

 

"By providing manufacturing service using GF's trusted U.S. manufacturing footprint, we are creating a secure, scalable source of essential advanced-packaging elements that will help customers accelerate innovation and strengthen the semiconductor supply chain."

The announcement positions the deal as part of a broader effort to build out the advanced packaging ecosystem in the United States, at a time when demand for AI and high-performance computing technologies continues to grow.

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Context on GlobalFoundries

GlobalFoundries, which trades on the Nasdaq under the ticker GFS, describes itself as a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world.

 

The company delivers solutions for automotive, aerospace and defense, data center, smart mobile devices, internet of things and other markets, with manufacturing operations across the U.S., Europe and Asia.

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