Fremont, California-based Aehr Test Systems (NASDAQ: AEHR) announced on October 7, 2026, approximately USD 6 million in follow-on production orders from its lead hyperscale customer for package-level burn-in (PLBI) of the customer's next-generation AI processor used in data center training and inference applications

Second Production Win on Sonoma Platform

The announcement marks the second AI processor from this customer to use Aehr's Sonoma platform for production burn-in, following a previously announced initial production win.

The orders cover additional Sonoma high-power package-level test and burn-in systems, fully turnkey burn-in modules (BIMs), device-specific sockets, and production software enhancements.

The systems and consumables will be deployed at one of the customer's outsourced semiconductor assembly and test (OSAT) partners in Taiwan, with deliveries scheduled over the next six months.

Ramp Expected in Calendar 2027

The follow-on orders expand the customer's capacity ahead of an expected production ramp of the second AI device in calendar 2027.

According to the announcement, the customer has indicated that this next-generation processor is expected to ultimately reach production volumes exceeding those of the customer's first processor brought into production burn-in on the Sonoma platform.

That first processor is already in high-volume production, with volumes expected to continue ramping significantly as additional Sonoma system capacity is deployed over the next several months.

Gayn Erickson, President and Chief Executive Officer of Aehr Test Systems, said the orders demonstrate the continued expansion of the relationship with the hyperscale customer and its confidence in Sonoma to support successive generations of increasingly powerful and complex AI processors.

He noted that the program is progressing from qualification and initial production systems to additional systems, consumables, and software supporting the anticipated production ramp, and that as volumes increase, Aehr believes there is potential for significant additional demand for Sonoma systems and device-specific consumables.

Multi-Zone Thermal Control for Complex AI Packages

The next-generation processor requires independently controlled thermal zones within each package to achieve the operating conditions needed for effective production burn-in and early-life failure screening.

Sonoma's multi-zone thermal control capabilities enable independent temperature management across different areas of a device while delivering the high current required to electrically stress the processor.

The platform also supports independent electrical test vectors and monitoring of multiple devices or functional elements within a multi-chip package. These capabilities address the differing power densities and thermal characteristics of advanced AI packages, which increasingly combine compute die, high-bandwidth memory, and interface components.

Erickson stated that as AI processors become more complex, controlling the temperature of the package as a whole is no longer sufficient for some applications.

He said Sonoma's ability to independently manage multiple thermal zones and electrical test functions helps customers address these challenges, and that Aehr believes these capabilities will become increasingly important as AI packages continue to grow in power, size, complexity, and value.

Discussions Extend to Wafer-Level Burn-In and Future Generations

Aehr is also engaged in detailed discussions with the customer regarding reliability qualification and production burn-in requirements for future generations of higher-power, larger AI devices. Those discussions include both Aehr's Sonoma package-level platform and its FOX-XP wafer-level burn-in (WLBI) platform.

Erickson explained that as the value of advanced AI packages increases, identifying early-life failures before expensive packaging can deliver significant economic benefits. WLBI can screen die before assembly, while PLBI can stress and screen the completed device.

Customers may choose either approach or use both at different stages of qualification and production, depending on their requirements. He added that Aehr's ability to support both approaches positions the company well as customers develop reliability strategies for future AI processors.

With Sonoma supporting the customer's first processor in high-volume production and now its next-generation program, Erickson said Aehr is building a foundation for continued growth as the customer's AI roadmap advances.

Company Background

Aehr Test Systems is headquartered in Fremont, California, and provides test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer-level, singulated die, and package-level form factors, with thousands of systems installed worldwide.

The company serves applications including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, advanced AI processors, data and telecommunications infrastructure, and solid-state memory and storage.

Its product portfolio includes the FOX-P families of test and burn-in systems, the FOX WaferPak Aligner, FOX WaferPak Contactor, FOX DiePak Carrier, and FOX DiePak Loader, as well as the FOX-XP and FOX-NP systems.

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