Element Six (E6), a world leader in synthetic diamond industrial solutions, and Entegris, Inc., a leading supplier of advanced materials and surface engineering for the semiconductor industry, announced a strategic collaboration on November 3, 2026, to accelerate the integration of diamond-enabled thermal management solutions into advanced packaging for graphics processing unit (GPU) and radio frequency (RF) devices.

Element Six and Entegris partner on synthetic diamond semiconductor solutions

The partnership was announced from Santa Clara, California, and is aimed at devices that enable high-performance computing (HPC), data centers, and high-speed wireless communications, underpinning applications across artificial intelligence (AI), telecommunications, and defense.

The collaboration combines Element Six's expertise in engineered synthetic diamond materials with Entegris' leadership in semiconductor materials science and surface engineering.

The companies will work together to develop scalable solutions for incorporating synthetic diamond into advanced semiconductor packages and devices.

Why thermal management is becoming a critical constraint

According to the announcement, as AI demands continue to drive rapid increases in chip power density, thermal management is becoming a critical determinant of semiconductor performance, efficiency, and scalability.

Semiconductor manufacturers and hyperscalers are increasingly seeking solutions that enable greater compute performance while reducing energy consumption and system complexity.

With conventional cooling technologies approaching practical limits, advanced materials such as synthetic diamond and its composites are expected to play an increasingly important role in enabling the next generation of GPU and RF devices.

Synthetic diamond possesses the highest thermal conductivity of any material at room temperature, making it a highly promising solution for advanced thermal management.

However, the companies noted that realizing its full potential requires innovative approaches to bonding diamond with semiconductor wafers and dies for integration into advanced packaging while minimizing thermal boundary resistance at the interface.

Engineered surfaces and bonded diamond technologies

The companies will collaborate to provide semiconductor manufacturers with a broad portfolio of diamond-enabled solutions, including engineered surfaces that meet challenging, customized specifications and bonded diamond technologies for both polycrystalline and single-crystal diamond platforms.

According to the announcement, this flexibility enables customers to select the approach best suited to their device architectures, packaging strategies, and performance requirements, reducing integration complexity and accelerating deployment.

The two companies said they are particularly focused on enabling scale, cost-effective wafer-level, and heterogeneous integration approaches that can reduce manufacturing complexity, minimize thermal boundary resistance, and support the performance requirements of next-generation GPU and RF devices.

Leadership perspectives on the partnership

"By combining E6's expertise in synthetic diamond materials with Entegris' surface engineering capabilities, we offer the semiconductor community a new tool box of synthetic diamond-based thermal management solutions, enabling new levels of performance and efficiency," said Siobhán Duffy, CEO at Element Six.

She noted that the semiconductor industry is actively seeking new ways to address thermal constraints as advanced semiconductor architectures continue to push device performance to new levels.

Olivier Blachier, Chief Innovation Officer and President of Materials Solutions at Entegris, said the opportunity with synthetic diamond is not simply to introduce a material with promising thermal properties but to engineer the surfaces and bonding approaches that make it suitable for advanced packaging.

He added that working with Element Six, Entegris is addressing an emerging industry challenge by developing a range of approaches from engineered surfaces to bonded synthetic diamond technologies to support the different requirements of next-generation GPU and RF devices.

Ambitions for scalable adoption

By enabling scalable manufacturing approaches and reducing integration complexity, the partnership aims to accelerate adoption of synthetic diamond across existing and emerging semiconductor needs, according to the joint announcement.

About the companies

Element Six, part of the De Beers Group, is a world leader in the design, development, and production of synthetic diamond advanced material solutions. The company operates worldwide with primary manufacturing facilities in the US, UK, Ireland, Germany, and South Africa.

For over eighty years, Element Six has harnessed the extreme properties of synthetic diamond in areas such as photonics, acoustics, power transmission, water treatment, thermal management, and sensors.

Its solutions are used across multiple industries, including manufacturing in the automotive and consumer electronics industries, cutting and drilling in the oil and gas industry, and components for mining, road, construction, and agriculture applications.

Entegris is a leading supplier of advanced materials and surface engineering for the semiconductor industry.

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