SUNON, the thermal solutions brand of Sunonwealth Electric Machine Industry Co., Ltd, has announced that it will focus on high performance AI computing with next generation liquid cooling solutions at the 2026 OCP Global Summit.

The company's showcase will run under the theme "Build to Chill" and is positioned as an exploration of comprehensive liquid cooling technologies for the AI era, spanning from the chip level all the way to the rack level.

Fan maker turns attention to liquid cooling for AI infrastructure

The announcement, issued from Kaohsiung under the title "From Chip to Rack: Exploring Comprehensive Liquid Cooling Technologies for the AI Era," frames liquid cooling as a critical technology for supporting the next generation of AI infrastructure.

According to the company, as AI computing continues to advance at an unprecedented pace, rising chip power densities and increasing thermal loads in data centers are creating new challenges for thermal management. It is against that backdrop that SUNON says liquid cooling is rapidly becoming essential to the industry.

A portfolio spanning chip, server, and rack levels

At the event, SUNON will showcase liquid cooling technologies and solutions across multiple levels of the AI computing infrastructure: chip level, server level, and rack level. The company describes this as building a complete liquid cooling ecosystem, one that integrates thermal technologies across these different levels.

By combining capabilities at each tier, SUNON aims to help customers address a wide range of power densities, operating environments, and system requirements.

The company says the resulting cooling solutions are designed to deliver greater efficiency, reliability, and deployment flexibility, three attributes it highlights as central to its approach for the AI era.

The chip to rack framing is the organizing principle of the showcase. Rather than presenting a single product category, SUNON is presenting its liquid cooling portfolio as a layered ecosystem, with offerings intended to serve the thermal demands that arise at the silicon, the server enclosure, and the data center rack alike.

Responding to escalating thermal demands

The core problem SUNON identifies is one that has grown alongside the AI buildout: thermal management pressure inside data centers. Rising chip power densities mean more heat generated in smaller areas, and increasing thermal loads across facilities put strain on traditional cooling approaches.

The company positions its next generation liquid cooling solutions as a direct response to these evolving thermal demands of high performance AI computing.

While the press release does not detail specific product specifications, it emphasizes the breadth of the portfolio and the intent behind it.

Visitors to the SUNON booth will be able to explore the company's latest liquid cooling technologies and products firsthand, and to connect with the SUNON team to discuss the evolving thermal challenges and future trends shaping AI data centers.

Event details and booth information

The 2026 OCP Global Summit takes place October 12–15, 2026, at the San Jose McEnery Convention Center in San Jose, California, USA. SUNON will exhibit at Booth A19, where it invites attendees to discover how the company is building what it calls the next generation of cooling for AI.

The appearance continues SUNON's presence at the OCP summit. The company previously unveiled next generation liquid cooling systems at the OCP Global Summit 2025, indicating a sustained commitment to engaging the open compute community on thermal solutions for AI hardware.

Context: liquid cooling's growing role in AI data centers

The announcement arrives amid broader industry attention to cooling as a bottleneck for AI performance. As SUNON's own framing makes clear, the thermal challenges confronting data center operators are intensifying as chip power densities climb and thermal loads grow across facilities.

Liquid cooling, in the company's assessment, is rapidly becoming a critical technology for the next generation of AI infrastructure, a shift that pushes thermal solution providers to think beyond individual components and toward integrated systems spanning chips, servers, and racks.

SUNON's "Build to Chill" theme captures that systems-level ambition. By presenting solutions at each level of the infrastructure stack and emphasizing integration across them, the company is staking out a position as a full ecosystem provider rather than a component supplier.

The emphasis on efficiency, reliability, and deployment flexibility suggests the company sees operator requirements, not just raw cooling capacity, as the differentiator in the market for AI era thermal solutions.

Looking ahead to San Jose

For attendees of the 2026 OCP Global Summit, the SUNON booth at A19 will serve as the venue to examine the company's liquid cooling portfolio across chip, server, and rack levels.

The company has invited visitors to engage its team in discussions about the thermal challenges and future trends shaping AI data centers, conversations that, given the trajectory SUNON describes, are likely to center on how the industry cools the increasingly dense and power hungry systems at the heart of AI computing.

The exhibition runs October 12 through 15 at the San Jose McEnery Convention Center, and the company's showcase is being promoted under the banner of its Kaohsiung based parent, Sunonwealth Electric Machine Industry Co., Ltd.

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