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SK Hynix Plans to Build a $15 Billion Semiconductor Packaging Plant in Indiana

Last Updated on 02nd February 2024

South Korean chipmaker SK Hynix is reportedly finalizing plans to construct a new USD 15 billion semiconductor packaging plant in Indiana. This development marks a significant stride for the US chip industry in its endeavor to reduce reliance on foreign production.

 

SK Hynix to Build a $15 Billion Semiconductor Packaging Plant in Indiana

 

The new plant will specialize in advanced packaging, a critical phase in chip manufacturing where individual chips are stacked and integrated into complex modules. Specifically, it will focus on producing high bandwidth memory (HBM) chips used in high-performance computing and artificial intelligence applications.

 

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Presently, SK Hynix manufactures HBM chips in South Korea and transports them to Taiwan for integration into Nvidia's graphics processing units (GPUs). Establishing the plant in the US would streamline this supply chain and potentially enhance security and efficiency.

 

This decision aligns with SK Hynix's earlier commitment to invest USD 22 billion in US chipmaking, announced in 2022. Moreover, it supports the US government's $3 billion initiative aimed at strengthening domestic chip packaging capabilities, particularly in response to supply chain vulnerabilities revealed during the pandemic. Indiana reportedly offered attractive incentives, including tax breaks and infrastructure support, to secure the project.

 

Although the final decision is pending an official announcement, SK Hynix's apparent selection of Indiana for its new chip packaging plant signifies a substantial stride towards US chip self-sufficiency and the potential reshaping of the global semiconductor landscape.

 

Read: TSMC to Build a Second Semiconductor Plant in Japan With an Expected Investment of $13.5 Billion

 

About SK Hynix

SK Hynix to Build a $15 Billion Semiconductor Packaging Plant in Indiana

 

SK Hynix is one of the largest semiconductor companies in the world. It supplies DRAM (dynamic random-access memory) and NAND flash memory chips. It is the world's second-largest memory chipmaker after Samsung Electronics and the world's sixth-largest semiconductor company.

 

Founded in 1983 as Hyundai Electronics Industries Co., Ltd., the company has manufacturing sites in Korea, the United States, China, and Taiwan. In 2012, when SK Telecom became its major shareholder, Hynix merged with SK Group, the third-largest conglomerate in South Korea at the time.

 

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