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Last Updated on 25th June 2024
SK Hynix and Micron have received advance payments from NVIDIA for the supply of high-bandwidth memory chips. Each of them has received approximately USD 540 million to USD 770 million from Nvidia for the provision of advanced memory products. In addition to this, Samsung Electronics recently signed an HBM product supply contract with Nvidia.
The fifth-generation HBM3E chips will be integrated with the next-generation GPUs. Nvidia sought to secure a stable supply due to the increasing demand for HBM chips.
The supply falls significantly short of the demand. To fortify the infrastructure for generative artificial intelligence, major tech companies, including HBM, are urging semiconductor manufacturing firms to provide HBM chips. The semiconductor market is ever-evolving, giving rise to new market trends.
Manufacturing HBM chips involves numerous challenges, such as reducing costs and ensuring the yield of the core through the silicon via (TSV) process. Due to the rapid transmission of data, the HBM chips produce massive heat.The 3rd and 4th generation products have controlled heat generation to some extent, but from the 5th generation onwards, each company has different solutions.
SK Hynix, the largest semiconductor manufacturer, is expanding its TSV facilities to meet the rising demand. Micron's investment in TSV facilities is expected to receive a boost after this advance payment. Meanwhile, Samsung Electronics has completed product suitability tests for HBM3 and HBM3E.
A through-silicon electrode (TSV), also known as a through-silicon via (TSV) or through-chip via, is a microscopic vertical electrical connection that penetrates completely through a silicon wafer or die. It acts as a tiny tunnel, allowing electrical signals to travel between different layers of silicon within a 3D integrated circuit (3D IC).
During the manufacturing process, tiny holes are drilled through the silicon wafer using a laser or other techniques. These holes are then lined with a conductive material, typically copper, using a process called electrodeposition.
SK Hynix is a South Korean multinational corporation renowned for its expertise in dynamic random-access memory (DRAM) chips and flash memory chips. It stands as the second-largest memory chipmaker in the world, trailing only Samsung Electronics, and the third-largest semiconductor company overall.
Micron Technology is a leading American multinational semiconductor company that manufactures and sells DRAM, NAND flash memory, and other related products. It is one of the largest memory manufacturers in the world, with headquarters in Boise, Idaho, and facilities throughout the United States, Asia, and Europe.
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