Silvaco Group (provider of semiconductor Intellectual Property (IP) solutions) has announced a partnership with Dassault Systèmes (a global leader in 3D design software) aimed at developing interoperable digital twin workflows for semiconductor manufacturing, with both companies citing growing complexity in device architectures and narrowing process windows as the driving force behind the collaboration.

The partnership, announced, brings together Silvaco's feature-scale semiconductor process simulation technology with Dassault Systèmes' SIMULIA multiphysics simulation applications.

The goal is to help semiconductor manufacturers make better engineering decisions before committing resources to costly physical experiments in fabrication facilities.

What the Partnership Is Designed to Solve

Semiconductor manufacturers are under increasing pressure to shorten development cycles, improve yields, accelerate technology ramps, and reduce overall development costs.

As device architectures grow more complex and process windows continue to narrow, identifying cause-and-effect relationships across equipment, process, and structural domains has become a critical engineering challenge.

The collaboration between Silvaco and Dassault Systèmes is intended to give engineering teams broader visibility into how upstream manufacturing decisions influence downstream process and structural outcomes.

By improving interoperability between complementary simulation technologies, the companies say customers will be able to investigate interactions across multiple scales, identify potential issues earlier in the development cycle, and make decisions with greater confidence.

Walden C. Rhines, Chief Executive Officer of Silvaco, described the rationale behind the partnership in direct terms. "The semiconductor industry is facing unprecedented manufacturing complexity, and our customers increasingly need predictive technologies that help them understand the impact of manufacturing decisions before costly experiments are performed in the fab," Rhines said.

He added that the ultimate goal is to help engineering teams make better decisions earlier, bringing new semiconductor technologies to production faster and with greater confidence.

Three Technical Integration Points

The partnership is organized around three distinct but connected technical workflows, each addressing a different scale of semiconductor manufacturing analysis.

The first is a reactor-scale to feature-scale connection. The companies intend to link plasma simulation capabilities within Dassault Systèmes' SIMULIA applications with Silvaco's VictoryProcess feature-scale semiconductor process simulation tool.

This workflow is designed to support multiscale studies of advanced plasma-based etch and deposition processes, helping customers better understand the relationship between equipment conditions and how features evolve at the wafer level.

The second integration point moves from feature scale to structural analysis. The company plans to enable the transfer of structures and material information generated within Silvaco process simulation workflows into Dassault Systèmes' SIMULIA structural analysis environments.

This capability is intended to support stress, deformation, and related structural analyses that the companies describe as increasingly important for advanced semiconductor technologies.

The third component focuses on the development of interoperable digital twin workflows more broadly. This involves building interfaces and workflow definitions that allow engineering data to move efficiently between the complementary simulation technologies while preserving the information required by downstream analyses. These connected workflows are described as an important foundation for broader semiconductor manufacturing digital twin initiatives.

Reducing Manual Handoffs and Rebuilding Work

One of the specific operational problems the partnership aims to address is the repeated manual reconstruction of geometry, material, and process information that engineers currently perform when moving data between different simulation environments.

The connected workflows are intended to reduce these manual handoffs and preserve the traceability between upstream process inputs and downstream manufacturing outcomes.

By allowing engineering data to flow more efficiently across simulation domains, the companies say customers will be able to evaluate more alternatives virtually before expensive experimentation in the fab.

This is described as a core element of what both companies refer to as first-time-right process development, a manufacturing objective in which processes are designed and validated digitally to a sufficient degree that physical trials succeed more consistently.

Scope of the Collaboration

Silvaco is listed on the Nasdaq exchange under the ticker SVCO and describes itself as a provider of TCAD, EDA software, and semiconductor IP solutions. Dassault Systèmes contributes its SIMULIA simulation portfolio to the collaboration, which spans multiphysics simulation and structural analysis capabilities.

The initial focus of the partnership, according to both companies, is practical interoperability between the complementary technologies. Over time, the connected workflows are expected to support more predictive, data-driven engineering decisions earlier in the development cycle, with the longer-term ambition of advancing first-time-right semiconductor manufacturing more broadly.

The companies describe the combined capability as linking equipment-scale physics, feature-scale process simulation, and structural analysis within connected workflows.

This multiscale approach is intended to help customers accelerate learning cycles and process optimization through more connected multiphysics analysis, and to establish a stronger digital foundation for advanced manufacturing digital twin deployments.

Industry Backdrop

The announcement comes as the semiconductor industry continues to invest in digital engineering methods to manage the escalating cost and complexity of advanced process development.

Physical experimentation in fabrication facilities remains expensive and time-consuming, and the industry has increasingly looked to simulation and digital twin approaches to front-load engineering insight before wafers are committed to process runs.

The Silvaco and Dassault Systèmes collaboration positions connected multiscale simulation workflows as a practical path toward addressing those challenges, with the partnership centered on interoperability between established simulation tools rather than the development of entirely new platforms from the ground up.

Track Every Chip Fabrication Venture Across Markets Worldwide

How confident are you that your team has full visibility into the semiconductor projects shaping global supply chains right now? In an industry where fab announcements, capacity expansions, and government-backed initiatives can shift competitive dynamics overnight, relying on fragmented intelligence is a risk no organization can afford.

The Global Project Tracking (GPT) platform by Blackridge Research was built to give semiconductor manufacturers, equipment suppliers, and investment firms a consolidated, continuously updated view of capital projects unfolding across markets worldwide. From leading-edge logic fabs to advanced packaging facilities, every stage of the project lifecycle is captured in one structured environment.

Whether you are monitoring competitor site selections, identifying procurement windows, or evaluating regional investment trends, the platform delivers the depth and timeliness your strategy demands.

• Upcoming Projects

• Tender Notices

• Contract Awards

• Projects Under Construction

• Completed Projects

See how the Global Project Tracking (GPT) platform by Blackridge Research can sharpen your semiconductor market intelligence. Book a Free Demo with our team today.