Renesas Electronics Corporation has introduced the SLG46801, a configurable mixed-signal device it describes as the industry's smallest GreenPAK IC available in a wafer-level chip-scale package.

Announced on September 24, 2026, the device targets compact consumer electronics such as smart rings, smartwatches, fitness bands, VR glasses, and portable electronics, where board space and component count are at a premium.

Package Options and Physical Dimensions

The SLG46801 is offered in two package formats. The primary option is a 9-ball WLCSP measuring 1.155mm × 1.155mm, which Renesas says represents the smallest WLCSP-packaged GreenPAK device in the industry. The second option is a 12-lead STQFN package measuring 1.6mm × 1.6mm × 0.55mm, providing additional GPIO availability and catering to applications where industrial package formats are preferred.

Renesas says the two package options allow customers to choose between the absolute minimum board footprint offered by the WLCSP and the expanded pin accessibility of the STQFN. The company also notes that the SLG46801 offers one of the lowest costs per GPIO in the broader GreenPAK product family.

Integrated Functions and Electrical Specifications

The SLG46801 integrates two high-speed analog comparators, configurable lookup tables, counters and delays, 10kHz and 25MHz oscillators, voltage-tolerant GPIOs, and an I²C-compatible serial interface. Renesas positions this combination of analog, timing, and logic resources as a means for designers to complement a microcontroller or replace multiple discrete components within a single compact device.

The device operates and can be programmed across a supply voltage range of 1.71V to 5.5V, which Renesas describes as the widest operating and configurable range among its multi-time programmable GreenPAK devices. GPIO pins can be dynamically repurposed to serve as the I²C interface, a feature Renesas says maximizes design flexibility in systems where pin availability is constrained.

Optional CRC-8 and read-back protection are also included to support more controlled and robust configurable implementations.

Multi-Time Programmability and In-System Updates

A central feature of the SLG46801 is its multi-time programmable non-volatile memory, which can be reconfigured in the field through the device's I²C interface. This capability allows engineers to implement bug fixes, configuration changes, and product upgrades after the device has already been integrated into an end application, reducing the need for hardware redesigns or additional board revisions.

Jason Kim, Vice President and General Manager of the Core Analog Division at Renesas, addressed the market demand driving the new product. "Designers are being asked to integrate more functionality into increasingly compact products without increasing system cost or development effort, while also reducing power consumption," Kim said.

"The SLG46801 expands our GreenPAK portfolio with an ultra-compact WLCSP option and flexible in-system configurability, helping customers create smaller, more feature-rich products and implement updates even after deployment."

The multi-time programmability is complemented by a target I²C enable function, which together allow configuration changes to be made after a product has shipped to end users, a capability Renesas highlights as reducing redesign cycles.

Target Applications and Market Positioning

Renesas describes the SLG46801 as addressing a broad range of application segments including consumer electronics, handheld devices, smart-home systems, networking and communications, computing and storage, industrial control, and IoT sensor nodes. The device's sensing, control, glue-logic, timing, and system housekeeping capabilities are cited as relevant to each of these categories.

The announcement reflects a stated industry trend in which consumer device manufacturers are being asked to deliver increasingly feature-rich products in shrinking form factors without raising bill-of-materials costs or expanding PCB area. Renesas says the SLG46801 is designed to meet these constraints by consolidating commonly used mixed-signal functions into a single low-power device.

Software Tooling

Configuration and development for the SLG46801 is supported by the Renesas Go Configure Software Hub, a free graphical user interface-based development environment. Renesas says the tool enables customers to develop custom hardware functions without requiring additional discrete components or complex firmware development. The software hub supports programming, emulation, and simulation for the device.

Company Context and Availability

Renesas states it has shipped more than four billion GreenPAK devices worldwide, positioning itself as a leader in configurable mixed-signal technology. The SLG46801 represents an addition to that portfolio focused specifically on the ultra-compact end of the size spectrum.

In terms of availability, the SLG46801 in the STQFN package is sampling as of the announcement date of September 24, 2026. The WLCSP package variant is planned for mass production availability in November 2026. Additional product information is available through the Renesas website at the product page for the SLG46801.

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