LG Electronics has officially joined the NVIDIA Partner Network (NPN) as a Power and Cooling Solution Preferred Partner, a designation the company announced on September 28, 2026. The membership strengthens LG's position in thermal management solutions for high-density AI data centers, according to the company's announcement from Seoul.

NVIDIA Partner Network Membership Confirmed

The collaboration with NVIDIA is framed by LG as a reinforcement of its thermal management capabilities for AI facilities, where rising thermal loads demand greater cooling efficiency. LG's data center solutions are designed to be integrated during the early stages of facility planning, providing a clear basis for the design of cooling systems and supporting infrastructure.

According to LG, this approach supports the delivery of infrastructure that meets the power and thermal management requirements of next-generation AI factories.

Largest Capacity Among DSX Ready CDU Partners

Central to the announcement is LG's 2.6-megawatt (MW) Coolant Distribution Unit (CDU), which recently qualified as an NVIDIA DSX Ready CDU. The company states that the 2.6MW unit has the largest cooling capacity among DSX Ready CDU partners, citing the time shown on the NVIDIA marketplace as the basis for that claim.

In addition to the 2.6MW unit, LG has completed infrastructure qualification for its 600kW and 1MW CDUs. Those qualifications required satisfying technical criteria covering cooling performance, failover capabilities, and reliability. LG says the NVIDIA qualifications demonstrate its expertise in liquid cooling across multiple stages of high-density AI infrastructure and highlight the efficiency and reliability of its liquid cooling solutions for global hyperscalers.

Direct-to-Chip Cooling in a Hybrid Architecture

LG's CDUs are engineered to manage the thermal demands of AI infrastructure through a direct-to-chip (DTC) liquid cooling approach, delivering coolant directly to the CPU, GPU, and other heat-generating components. The units operate in synergy with existing air-cooling infrastructure to form a hybrid cooling system, according to the company.

The CDUs that have completed NVIDIA AI infrastructure qualification are being showcased at Data Centre World Asia 2026 (DCWA 2026), held September 29–30 at Marina Bay Sands in Singapore, an appearance that follows immediately on the heels of the partnership announcement.

4.0MW Qualification Planned by Year-End

LG also laid out its next step: by the end of this year, the company plans to pursue NVIDIA qualification for its 4.0MW CDU model. The company describes this as reinforcing the quality of its growing portfolio of liquid cooling solutions for next-generation AI data centers.

ES Company President on the Partnership

James Lee, president of the LG ES Company, characterized the network membership as a strategic milestone. "Joining the NVIDIA Partner Network as a Power and Cooling Preferred Partner is a pivotal step in our strategy to support the expansion of the global AI ecosystem," Lee said. "Together with NVIDIA, LG will help shape the future of AI data centers by delivering advanced cooling solutions that address the industry's most critical thermal challenges."

The announcement was published under LG's Eco Solution news category, where the company also highlighted related data center cooling work, including the qualification of the 2.6MW CDU and the launch of an air-cooled centrifugal chiller for AI data centers.

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