Union Electronics and IT Minister Ashwini Vaishnaw announced the approval of the first batch of seven projects under the Electronics Components Manufacturing Scheme (ECMS) on October 27, 2025. The approved projects represent an investment of INR 5,532 crores and are expected to generate production worth INR 36,559 crores while creating over 5,100 direct jobs.

The initiative will enable domestic production of Multi-Layer Printed Circuit Boards (PCBs), HDI PCBs, Camera Modules, Copper Clad Laminates, and Polypropylene Films in India. This marks a significant step in India's transition from manufacturing finished products to producing the modules, components, materials, and machinery used to manufacture them.

Geographic Distribution and Regional Impact

The approved manufacturing units are strategically distributed across three states: Tamil Nadu hosts five projects, Andhra Pradesh one, and Madhya Pradesh one. This distribution reinforces balanced regional growth and expands high-tech manufacturing beyond metropolitan areas. The ECMS has received an overwhelming response from both domestic and global companies, with 249 applications submitted.

These applications collectively represent an investment of INR 1.15 lakh crore, a production value of INR 10.34 lakh crore, and the potential creation of 1.42 lakh jobs, marking the highest-ever investment commitment in India's electronics sector.

Domestic Demand and Export Projections

Minister Vaishnaw stated that the new manufacturing facilities will meet 20 percent of India's domestic demand for PCBs and 15 percent of Camera Module sub-assembly requirements. The projects will completely fulfill domestic demand for Copper Clad Laminate, which is currently imported. Additionally, 60 percent of the total production from these plants will be exported.

The Camera Modules to be produced are compact imaging units that capture photos and videos in electronic devices. Their domestic production will enable usage in smartphones, drones, laptops, tablets, medical instruments, robots, and automotive systems. HDI and Multi-Layer PCBs serve as core circuit boards that connect and control every electronic device, finding applications in smartphones, laptops, automotive, and industrial systems.

Strategic Materials Manufacturing

The ECMS represents India's strong entry into the component materials manufacturing sector. For the first time, India will establish a Copper Clad Laminate (CCL) manufacturing facility. CCL serves as a base component for the manufacturing of Multi-layer PCBs, which are incorporated into every piece of electronic equipment and are currently imported. Polypropylene Films, another key material to be manufactured domestically, are used in manufacturing capacitors.

This component will be produced in India for Consumer Electronics, Automotive, ICT, Industrial & Manufacturing, and Telecommunications & Computing equipment.

Economic and Industrial Implications

The approved projects are designed to reduce import dependence and lower domestic product prices. They will create high-skilled jobs in manufacturing and research and development. The initiative will also build trusted supply chains for defense, telecommunications, electric vehicles, and renewable energy sectors. The scheme complements existing initiatives, including the Production Linked Incentive (PLI) scheme and the India Semiconductor Mission (ISM).

It creates a seamless value chain spanning from devices to chips, components to materials, and from manufacturing to innovation, supporting India's journey toward becoming a product nation capable of designing, manufacturing, and exporting end-to-end electronic equipment.

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