Fujifilm Invests $18 Million to Expand CMP Slurry Manufacturing in US

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Fujifilm Invests $18 Million to Expand CMP Slurry Manufacturing in US

Updated on Oct 13, 2026, 11:59 PM IST
Written & Edited by Harikesh VA

FUJIFILM Corporation will expand its semiconductor materials business by enhancing production facilities for copper interconnect CMP (Chemical Mechanical Planarization) slurries at the FUJIFILM Electronic Materials U.S.A., Inc. production site in Mesa, Arizona, the company announced on October 13, 2026.

 

Expansion of CMP slurry production facilities to meet growing demand

The USD 18 million investment also includes establishing new production facilities capable of multi-product manufacturing of CMP slurries for diversified semiconductor manufacturing processes, including advanced packaging applications.

The expansion addresses increasing demand for copper interconnect CMP slurries and supports long-term growth in advanced logic, advanced memory, and advanced packaging applications, according to the company's announcement.

 

Growth driven by AI, says Fujifilm executive

Brian O'Donnell, president & CEO of FUJIFILM Electronic Materials U.S.A., Inc. and corporate vice president of FUJIFILM Corporation, tied the investment to broader market conditions.

 

"The advanced semiconductor market has entered a period of significant growth, driven by the rapid expansion of demand related to artificial intelligence," O'Donnell said.

 

"As global semiconductor demand continues to increase, demand for CMP slurries, an essential material used in advanced semiconductor manufacturing, is also growing."

Fujifilm noted that demand for CMP slurry for copper interconnects, a product for which the company holds a leading global market share, is increasing in the advanced logic and memory sectors.

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U.S. semiconductor investment underpins the move

The company pointed to conditions in the United States as a key factor behind the decision. Major semiconductor manufacturers continue to invest in new and expanded production facilities in the country, resulting in high demand for semiconductor materials.

 

In response to these market conditions, FUJIFILM Electronic Materials U.S.A., Inc. will expand its CMP slurry production in Mesa.

From BEOL capacity to multi-product flexibility

The scope of the project extends beyond a single product line.

 

In addition to expanding capacity for copper interconnect CMP slurries used in BEOL (Back End of Line) processes, Fujifilm will establish new production facilities capable of manufacturing a wide range of CMP slurry products for FEOL (Front End of Line), MOL (Middle of Line), and advanced packaging applications, including hybrid bonding.

According to the company, these steps cover the major stages of semiconductor fabrication.

 

BEOL refers to the wiring process in which devices such as transistors formed on a wafer are interconnected with metal wiring layers, enabling electrical signal transmission throughout the integrated circuit.

 

FEOL is the process of forming semiconductor devices such as transistors, capacitors, and resistors on the surface of a silicon wafer, while MOL is the intermediate interconnection process that connects the terminals of transistors formed during FEOL to the first layer of metal interconnects.

CMP slurry itself is described by Fujifilm as an abrasive material used to uniformly flatten semiconductor surfaces where wiring and insulating films of varying hardness coexist.

Linking R&D to mass production

A stated purpose of the new facilities is to shorten the path from development to volume output.

 

Fujifilm said the new production facilities will serve as a bridge between product development and commercial manufacturing, enabling technologies developed at the Arizona site's global CMP slurry R&D center to be transferred quickly into mass production.

The expanded production line is scheduled to begin operations in 2027. Once operational, CMP slurry production capacity at the Mesa facility will further support medium- and long-term growth in demand, the company said.

Portfolio strategy from leading-edge to legacy nodes

Going forward, Fujifilm said it will continue to provide a broad portfolio covering nearly all semiconductor manufacturing processes, from leading-edge to legacy nodes.

 

The company also emphasized its global footprint, stating it will leverage a manufacturing network across Japan, the United States, Europe and Asia, together with its R&D capabilities, to offer one-stop solutions that help address customers' challenges and contribute to the continued development of the semiconductor industry.

About FUJIFILM Electronic Materials

FUJIFILM Electronic Materials operates manufacturing facilities in Asia, the United States, and Europe and offers a wide range of electronic materials required to produce semiconductors.

 

Its product range includes photoresists, photolithography-related materials, CMP slurries, post-CMP cleaners, thin-film materials, photosensitive insulating materials such as polyimides under the ZEMATES™ brand, high-purity process chemicals, and ultra-pure solvents. The company also provides Wave Control Mosaic™, a group of functional materials, including color filter materials for image sensors.

With an extensive portfolio covering semiconductor manufacturing processes from leading-edge to legacy nodes, FUJIFILM Electronic Materials maintains a global supply chain with manufacturing and research and development sites in Asia, the United States, and Europe.

 

The company states that by providing a one-stop solution to address customer needs, it contributes to the advancement of the semiconductor industry.

Announcement details

The press release was issued by FUJIFILM Corporation under the headline "Fujifilm to Expand CMP Slurry Production Capacity in the United States."

 

U.S. media contacts listed for the announcement are Christopher Smalley, Senior Marketing & Communications Strategist at FUJIFILM Electronic Materials U.S.A., Inc., and Robert Wallace, Senior Manager of Corporate Communications at FUJIFILM Holdings America Corp.

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