Japan’s semiconductor companies, like Toshiba and Hitachi, dominated the market in both chip design and manufacturing between the 1960s and 1980s. At that time, six of the top 10 global chip makers were Japanese. The decline of Japan’s semiconductor market was evident at the beginning of the 21st century, which shrunk to 9% of global market share in 2022 from 50% in 1989.

In 2025, the reviving semiconductor market in Japan is worth an estimated USD 50.6 billion. According to Blackridge Research’s semiconductor fabrication plant database, a modest 4% compound annual growth rate (CAGR) is expected in the Japanese market.

Japan still contributes approximately 10% of global semiconductor sales, from Sony’s dominance in image sensors to Renesas’ leadership in automotive microcontrollers and Tokyo Electron’s international influence in chip manufacturing equipment.

In this blog, we explore the list of the top 10 semiconductor companies in Japan according to revenue generated in 2024.

List of Top 10 Semiconductor Companies in Japan (2025) - According to Revenue Generated in 2024

Kioxia Holdings Corporation

Headquarters: Tokyo, Japan
CEO: Nobuo Hayasaka
Employees: 15,000 (as of 2025)

Kioxia Holdings Corporation is the largest semiconductor company in Japan, according to the revenue generated in 2024. The computer memory technology company was formerly part of Toshiba and was spun off in June 2018. The company rebranded itself as Kioxia in October 2019.

Kioxia is focused on high-density 3D flash memory through its proprietary BiCS FLASH™ technology. This technology is critical for modern data storage across smartphones, PCs, SSDs, automotive systems, and large-scale data centers.

The company is responsible for producing roughly one-third of the world’s flash memory, primarily through its two major facilities in Japan: 

• Yokkaichi Plant (Mie Prefecture) – a 694,000 sq.m complex with six integrated manufacturing sites and a deep R&D partnership.
   

• Kitakami Plant (Iwate Prefecture) – operational from 2020, addressing global demand growth.
  
   

Kioxia's product portfolio includes: 

• TLC/QLC 3D NAND for SSDs

• UFS/eMMC for mobile devices

• Emerging storage-class memory. 

In 2025, the company introduced its 10th-generation 332-layer 3D NAND with a 4.8 Gb/s Toggle DDR6.0 interface, achieving a 33% performance boost over the previous generation.

Kioxia announced OCTRAM in December 2024 at the IEEE International Electron Devices Meeting (IEDM). This new class of 4F2 DRAM utilizes oxide-semiconductor channel transistors (InGaZnO) to deliver high ON currents with ultra-low leakage, enabling efficient, low-power DRAM designs.

Renesas Electronics Corporation

Headquarters: Tokyo, Japan

CEO: Hidetoshi Shibata

Employees: Approximately 21,000 (as of 2024)

Renesas Electronics Corporation is one of the biggest semiconductor firms in Japan, specialising in embedded semiconductor solutions. The company primarily focuses on power, automotive, industrial, infrastructure, and IoT applications. Renesas blends advanced embedded processing with analog, connectivity, and power technologies to deliver complete system-level solutions across a diverse range of industries.

Founded in 2002 from the merger of the semiconductor divisions of Hitachi and Mitsubishi (excluding DRAM), Renesas has evolved into one of the world’s top suppliers of microcontrollers (MCUs), SoCs, analog integrated circuits, and power management devices. Its solutions are embedded in billions of intelligent, connected devices shaping smart cities, autonomous vehicles, industrial automation, and next-generation consumer electronics.

Renesas operates five front-end semiconductor fabrication plants across Japan, managed by its subsidiary Renesas Semiconductor Manufacturing Co., Ltd., which are:

1. Naka Factory (Headquarters)

2. Takasaki Factory

3. Saijo Factory

4. Kawashiri Factory

5. Kofu Factory

In 2024, Renesas, one of the largest semiconductor manufacturers in Japan, introduced the world’s first “8-in-1” proof of concept for electric vehicle (EV) E-Axle systems, developed in partnership with Nidec Corporation. A live demonstration was showcased at Electronica 2024 in Munich, Germany.

New semiconductor products of Renesas include:

• RAA2S4704 Multi-Channel Impedance Measurement IC - Automotive Impedance Sensors

• The New SmartBond Dual-Core Bluetooth® LE 5.3 SoC with Embedded Flash - Bluetooth Low Energy

• New 1.8V PCIe Gen7 Clock Buffers with 4 & 8 Outputs - PCI Express Clocks

Renesas also expanded its reach in IoT and Industry 4.0 with the acquisition of Dialog Semiconductor, now a wholly owned subsidiary. Dialog enhances Renesas’s portfolio with low-power wireless connectivity, configurable mixed-signal ICs, battery management, and flash memory technologies, supporting next-gen mobile and industrial applications.

Read: List of Top Fabless Semiconductor Companies in the World (2025)

Sony Semiconductor Solutions Corporation

Headquarters: Atsugi, Kanagawa, Japan

CEO (Representative Director and President): Yoshihiro Yamaguchi

Employees: Approximately 8,900 (Sony Semiconductor Solutions Corporation)

Total Employees Including Manufacturing Subsidiary: ~21,800 (as of April 1, 2025)

Sony Semiconductor Solutions Corporation, a wholly owned subsidiary of Sony Group Corporation, is a global leader in image sensor technology and a key player in the broader semiconductor industry. Founded in 2015 and operational since April 2016, the japanese company focuses on delivering device solutions that add value and inspire new user experiences across industries.

Sony Semiconductor Solutions is best known for its industry-leading image sensors and develops a wide range of products, including LSIs, semiconductor lasers, microdisplays, and advanced sensing devices. These technologies are used in everything from smartphones and digital cameras to automotive systems, robotics, and industrial imaging solutions.

Sony Semiconductor Manufacturing Corporation, a key subsidiary based in Kikuyo, Kumamoto, Japan, oversees the company’s primary production operations and employs around 12,900 people.

Sony Semiconductor Sites in Japan

Toshiba Electronic Devices & Storage Corporation

Headquarters: Minato, Tokyo, Japan

CEO: Taro Shimada (President and CEO of Toshiba Corporation)

Employees (Global - Toshiba Group): Approximately 106,000 (as of 2024)

Toshiba Corporation is the inventor of NAND flash memory and one of the top 10 chip manufacturers in the world. Toshiba’s semiconductor business is focused on delivering high-performance solutions across automotive, industrial, and consumer applications.

Toshiba remains a leading supplier of analog, power, and discrete semiconductors with decades of innovation. As a leading semiconductor company in Japan, it continues to maintain a diverse portfolio even after spinning off its flash memory division into Kioxia.

Key Product Categories

• Power Semiconductors: MOSFETs, IGBTs/IEGTs, Intelligent Power ICs, Power Management ICs

• Analog & Mixed-Signal ICs: Linear ICs, Motor Driver ICs

• Discrete Components: Diodes, Bipolar Transistors

• Logic Devices: General-Purpose Logic ICs, Interface Bridge ICs

• Sensors: Linear Image Sensors, Radio-Frequency Devices

• Automotive ICs: Designed to support EVs, ADAS, and powertrain systems

• Connectivity & Communication: ICs for wireless and mobile peripherals
  
   

Target Sectors

• Automotive: Toshiba supports the global shift toward vehicle electrification with advanced semiconductors for power efficiency and safety.

• Industrial Equipment: Devices built for environmental resistance, reliability, and long lifecycle support.

• Consumer Electronics: ICs that help miniaturize and increase the efficiency of portable and personal electronic devices.

ROHM Semiconductor

Headquarters: Kyoto, Japan

CEO: Isao Matsumoto (President and CEO)

Employees: 23,319 (Consolidated, as of 2024)

ROHM Semiconductor is a leading Japanese semiconductor company known for its portfolio of analog and power semiconductor products. ROHM was founded in Kyoto in 1958 and became a global innovator in power management and discrete device technologies, supplying critical components across automotive, industrial, consumer, and wireless markets.

ROHM’s expertise as an analog and power chip supplier spans MOSFETs, IGBTs, SiC (Silicon Carbide) and GaN (Gallium Nitride) devices, along with advanced analog ICs, sensors, silicon wafer, and photonic solutions. These semiconductor materials are integral to high-efficiency power conversion, motor control, and sensor-driven systems in electric vehicles (EVs), renewable energy, factory automation, advanced chips and smart devices.

Key Product Lines

• Discrete Power Devices: Si MOSFETs, IGBTs, Zener and Schottky diodes

• Wide-Bandgap Semiconductors:

1. SiC MOSFETs for xEVs and industrial power systems

2. GaN HEMTs (650V) for high-frequency, compact power designs

• Analog ICs: Power management ICs, op-amps, and analog front-end solutions

• Optoelectronics: Photodiodes, infrared sensors, and LED drivers

• Sensors: Hall ICs, temperature sensors, and current sensing ICs

In April 2024, Rohm developed a silicon carbide (SiC) power semiconductor device designed to be 50% more energy-efficient than competing parts, which helps electric vehicles that charge faster and travel longer. The new product combines four to six existing Rohm semiconductors into a single module.

Seiko Instruments Inc. (SII)

Headquarters: Chiba, Japan
CEO: Yoshinobu Yoshida (Representative Director & President)
Employees: Approximately 3,000 (as part of Seiko Group, as of 2024)

 

Seiko Instruments Inc. (SII), a subsidiary of the Seiko Group, is a Japanese leader in high-precision electronics, specializing in semiconductors, MEMS technologies, and micromechatronics. Originally founded as part of the Seiko watchmaking heritage, SII has evolved into a globally recognized supplier of ultra-compact and power-efficient semiconductor solutions.

SII's semiconductor division is built around analog and digital ICs, including precision timing devices, small microcontrollers (MCUs), quartz oscillators, and MEMS sensors. Its components are widely used in consumer electronics, automotive systems, industrial IoT, and wearable technology.

Key Product Lines

• Quartz Oscillators & Timing ICs: High-precision modules for timing-critical systems

• MEMS Sensors: Including cabin-sensing 60GHz RF CMOS for automotive/IoT

• Microcontrollers & ASICs: For printers, wearables, and industrial automation

• Thin-Film Batteries: Lightweight, compact power sources for IoT and medical devices

• Inkjet Printheads: High-resolution, fine-pitch printing solutions

Read: Global Top 10 EV Battery Manufacturers (2025)

RAMXEED Limited - Fujitsu Semiconductor Memory Solution Ltd

Headquarters: Yokohama, Japan

CEO: Kagemasa Magaribuchi (President and Representative Director)

Core Focus: Non-volatile memory technologies – FeRAM & ReRAM

RAMXEED LIMITED, formerly known as Fujitsu Semiconductor Memory Solution, is a cutting-edge Japanese memory semiconductor company focused on the development and commercialization of next-generation non-volatile memory products. The company was renamed in January 2025 while expanding its focus on advanced memory technologies.

The company specializes in two primary technologies:

1. FeRAM (Ferroelectric RAM): Known for its low power consumption and fast write speeds, ideal for energy-sensitive and high-reliability applications such as metering, industrial automation, and automotive systems.

2. ReRAM (Resistive RAM): A promising next-gen memory type offering high-speed, non-volatile storage with strong endurance and scalability. RAMXEED introduced its first 4Mb ReRAM product in 2016 through a co-development with Panasonic Semiconductor Solutions.

Key Product Categories

• FeRAM: Serial and parallel interface products for industrial and automotive use

• ReRAM: Compact, low-power embedded memory for MCU and IoT platforms

• ASIC/ASSP: Custom memory-integrated solutions for system-on-chip (SoC) designs

• STT-MRAM Research: Active development in spin-transfer torque magnetic RAM, a future candidate for high-speed, non-volatile memory

Mitsubishi Electric Corporation

Headquarters: Tokyo, Japan

CEO: Kei Uruma (President & CEO)

Employees: Approx. 145,000 (consolidated, FY2024)

Mitsubishi Electric Corporation is a global leader in electronics and electrical equipment, and a key innovator in semiconductor technologies that enable both Green Transformation (GX) and Digital Transformation (DX). The company develops advanced semiconductors and devices that power everything from industrial automation and automotive systems to high-speed communications and renewable energy systems.

Core Semiconductor Segments

1. Power Devices: Mitsubishi Electric is a pioneer in Silicon Carbide (SiC) power technology, including:

   1. Full and hybrid SiC power modules

   2. SiC DIPIPM (Dual In-line Package Intelligent Power Modules)

   3. High-voltage SiC MOSFETs

   4. Driver ICs and bare die solutions

2. Optical Devices: Designed for high-speed and high-capacity optical fiber communications, these devices are crucial in: 

   1. Data centers

   2. 5G base stations

   3. Fiber-to-the-home (FTTH) deployments

   4. Notable products include laser diodes for optical networks and high-performance projectors. 

3. High-Frequency Devices: Mitsubishi’s GaN and Silicon RF devices support robust wireless connectivity, with applications in: 

   1. 5G base transceiver stations (BTS)

   2. Satellite communications (SATCOM)

   3. Business-use radio systems 

4. Other Key Technologies: 

   1. Sensors: Including contact image sensors for industrial and imaging systems

   2. TFT-LCD Modules: For displays in industrial and automotive use

   3. High-Power Modules & IPMs: Integrated power solutions for demanding applications

In 2023, the Japanese semiconductor manufacturer announced a JPY 100 billion investment in a new semiconductor factory in Kumamoto Prefecture, scheduled to begin production in April 2026. This facility will support rising global demand for power devices and next-gen semiconductors.

Fuji Electric Co., Ltd.

Headquarters: Tokyo, Japan

CEO: Michihiro Kitazawa (President & Chairman of Fuji Electric Co., Ltd.)

Employees: Approx. 27,300 (consolidated, FY2024)

Fuji Electric is a prominent global provider of power semiconductors, known for delivering high-efficiency, high-performance solutions across energy, automotive, industrial, and IT sectors. Fuji Electric’s semiconductor products are manufactured across six sites in Japan, including these largest four:

• Matsumoto Factory

• Yamanashi Factory

• Fuji Electric Power Semiconductor Co., Ltd.

• Fuji Electric Tsugaru Semiconductor Co., Ltd.

In November 2024, Japan's Denso and Fuji Electric will join forces to manufacture energy-efficient silicon carbide (SiC) power semiconductor devices for electric vehicles. Third of the JPY 211.6 billion project was covered by the Ministry of Economy, Trade and Industry. Denso and Fuji Electric will expand production facilities in Japan for the project, eyeing an annual output capacity of 310,000 units by May 2027.

Socionext

Headquarters: Yokohama, Kanagawa

CEO: Hiroshi Noguchi (President and CEO)

Employees: 2500

Socionext Inc. is a Japan-based semiconductor company headquartered in Yokohama, Kanagawa. The company was established in March 2025 as a spin-off from the system LSI businesses of Fujitsu and Panasonic.

The company operates under a unique "Solution SoC" business model, engaging with customers early in the product development cycle to create highly tailored semiconductor solutions. This collaborative approach helps customers achieve differentiation in their products through optimized and specialized chip designs.

The company’s core technology focus lies in imaging, networking, and computing sectors that drive innovation across a range of industries. Socionext offers extensive design and implementation support, leveraging a rich portfolio of proprietary intellectual property (IP) and proven methodologies.

Renaissance of the Semiconductor Industry in Japan

Japan’s semiconductor industry, once dominant in the 1980s, is now staging a purposeful comeback. The semiconductor market in Japan is valued at USD 50.6 billion in 2025 (around 10% of the global market). Its 4% CAGR growth is slower than that of other competitors, but it is increasingly strategic in nature. 

This transformation is driven by government intervention, private-public collaboration, and sector-specific strengths in memory, sensors, and power semiconductors. For decision-makers, Japan represents not just a market but a critical partner in global supply chain resilience and technological diversification.

Government-Backed Revival: JPY 10 Trillion in Strategic Investment

The Japanese government has committed JPY 1.05 trillion (USD 7 billion) to next-generation chip and quantum computing research, along with JPY 471.4 billion for domestic advanced chip production, as part of Prime Minister Shigeru Ishiba’s broader JPY 10 trillion initiative for semiconductor and AI development by 2030. 

Read: TSMC to Open Japan's Most Advanced Semiconductor Production Facility

This investment strategy emphasizes economic security, technological leadership, and national defense. Key beneficiaries include Rapidus, Taiwan Semiconductor Manufacturing Company (TSMC), and Micron Technology, all working on projects to enhance advanced chipmaking and fortify Japan’s high-tech supply chain. Notable investments include:

• JPY 1.2 trillion to support TSMC’s Kumamoto plant, which began operations in 2024.

• JPY 920 billion for Rapidus, Japan’s national logic chip project, aiming to produce 2-nm chips by 2027.

• A JPY 65 billion fund was launched in 2024 to promote domestic semiconductor R&D, talent development, and ecosystem growth.

Strategic Partnerships with Global Leaders

Japan is leveraging deep international partnerships to close its technological gap and integrate into the global innovation cycle. Rapidus’s collaboration with IBM and IMEC for advanced nodes exemplifies this approach. Similarly, TSMC’s Kumamoto investment reinforces Japan's role as a stable, advanced manufacturing base. These alliances not only fast-track Japan’s tech maturity but also insulate the global supply chain from geopolitical disruptions.

Market Focus: Power Semiconductors, Image Sensors, Memory, and Microcontrollers

Japanese firms continue to lead in specialized, high-value semiconductor domains:

• Image Sensors: Sony holds over 40% of the global CMOS image sensor market, supplying smartphones, vehicles, and industrial systems.

• Power Semiconductors: Rohm, Mitsubishi Electric, and Toshiba dominate in SiC/GaN devices, which are critical for EVs and renewables.

• Memory: Kioxia is a top-tier NAND flash supplier with BiCS FLASH™ 3D technology.

• Microcontrollers: Renesas leads in automotive MCUs, particularly with the R-Car and RH850 series.

Future Outlook: From Supporting Role to Strategic Leadership

Japan’s semiconductor industry is ready for a strategic shift over the next five years. One of the most ambitious initiatives is Rapidus’s plan to mass-produce 2-nanometer logic chips by 2027. Backed by JPY 330 billion in Japanese government funding and supported by collaborations with IBM and IMEC.

This initiative could elevate Japan into the advanced logic chip segment, a domain currently dominated by Taiwan semiconductor manufacturing co. and Samsung. This would mark Japan’s re-entry into the elite tier of semiconductor manufacturing and provide much-needed diversification to global chip supply chains and the Japanese market.

In memory and power semiconductors, Japanese semiconductor firms are well-positioned for expansion. Kioxia, a key global player in NAND flash, continues to invest in high-capacity storage solutions, particularly BiCS FLASH™ 3D memory, used in everything from smartphones to enterprise servers. 

Simultaneously, Rohm and Toshiba are expanding their offerings in power semiconductors, including SiC and GaN devices, which are critical components in electric vehicles, renewable energy systems, and industrial automation. 

The presence of major domestic data center operators like NTT Communications and KDDI Telehouse, combined with investments in high-bandwidth memory (HBM) and AI accelerators, provides a platform for Japanese semiconductor companies to gain relevance in the high-growth AI chip sector.

Conclusion

The Japanese semiconductor industry is on the verge of a promising revival. While growth remains moderate compared to global trends, the country’s deep-rooted strengths in specialized technologies like image sensors, microcontrollers, and power devices provide a solid foundation for global competitiveness in semiconductor technology. The growth of the semiconductor market in Japan is backed by bold government investments and strategic collaborations with global players such as TSMC, Intel corporation and IBM.

Still, for this resurgence to be fully realized, Japan must address its long-standing challenges, particularly in workforce development and advanced manufacturing capabilities in semiconductor development. If these hurdles are managed effectively, Japan’s semiconductor sector could transition from a support player to a driving force in the global semiconductor market. This will prepare Japan's advanced semiconductor production  industry to compete with other silicon valley companies.

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FAQs

What is the largest semiconductor company in Japan?

Kioxia is the largest semiconductor company in Japan in terms of revenue in 2025. The company reported a revenue of USD 11.43 billion in the 2024 financial year.

How big is the Japanese semiconductor market?

Japan's semiconductor market is projected to be worth USD 50.6 billion (JPY 7.9 trillion) in 2025, growing from USD 46.75 billion in 2023. The country remains strong in semiconductor equipment, materials, memory, power devices, and image sensors, backed by major players like Renesas, Kioxia, Sony Semiconductor, and Rohm.

Why did Japan lose the semiconductor industry?

Japan lost its dominant position in the semiconductor industry due to a combination of factors:

• Technological lag: Japanese fabs fell behind in adopting cutting-edge process nodes like 7nm and 3nm, while TSMC and Samsung advanced rapidly.

• Workforce and R&D gaps: A shrinking talent pool and underinvestment in next-gen technologies slowed innovation.

• Restructuring missteps: Past failures like Elpida’s bankruptcy in 2012 showed the risks of fragmented strategies and government misalignment.

• Global competition: The rise of Korea, Taiwan, and the U.S., along with trade shifts, reshaped the global chip supply chain away from Japan.