South Korea maintains its position as the world’s second-largest semiconductor market, holding around 19% of the global share. The country leads the memory segment with 60.5% market share, including 70.5% of DRAM and 52.6% of NAND.

The two largest South Korean semiconductor companies, Samsung Electronics and SK Hynix, are global leaders in DRAM and NAND production. Alongside them, other major Korean semiconductor companies like LG Innotek, Samsung Electro-Mechanics, Dongjin Semichem, Hana Micron, SIMMTECH, DB HiTek, Hanmi Semiconductor, and Nepes are shaping the industry with innovations in packaging, substrates, semiconductor materials, and equipment.

This article highlights the top 10 South Korean semiconductor companies in 2025 according to the latest revenue, showcasing their core businesses, semiconductor products, and recent advancements.

List of Largest Semiconductor Companies in South Korea 2025 (according to revenue)

Samsung Electronics

Samsung Electronics is the largest semiconductor company in Korea, ranked according to the revenue generated in 2024. Since entering the semiconductor business in 1974 through the acquisition of Korea Semiconductor, the company has grown into a powerhouse that supplies critical components to top global clients, including Apple, Sony, HTC, and Nokia.

Samsung, one of the largest semiconductor companies in the world, has built a commanding presence in both memory and logic chips, underpinned by advanced manufacturing capabilities and continuous investment in R&D. In 2024, the company reached several milestones such as developing the industry’s first 12-stack 36GB HBM3E, introducing the first 24Gb GDDR7 DRAM, beginning mass production of the 9th-generation V-NAND, and opening a High Performance Computing (HPC) Center in Hwaseong, Korea.

In July 2025, Samsung Electronics and ASML announced a joint USD 760 million investment to build an advanced semiconductor fabrication plant in South Korea. The facility will deploy next-generation EUV lithography equipment to produce cutting-edge chips for mobile and high-performance applications.

Main semiconductor products:

• DRAM (Dynamic Random-Access Memory)

• NAND flash memory

• High Bandwidth Memory (HBM3E)

• GDDR7 DRAM

• V-NAND (9th generation)

• Logic chips through its foundry business

Here is the list of semiconductor manufacturing sites of Samsung in Korea:

SK Hynix

SK Hynix Inc., headquartered in Icheon, South Korea, is the world’s second-largest memory chipmaker and a leading supplier of semiconductors in Korea. Founded as Hyundai Electronics in 1983, the company became part of the SK Group in 2012 and has since grown into a global leader in DRAM and NAND flash memory production.

SK Hynix supplies memory solutions to major technology companies, including Microsoft, Apple, Asus, Dell, HP, and Hewlett-Packard Enterprise. Its products power a wide range of devices, from smartphones and computers to data centers and AI systems.

Over the years, SK Hynix has consistently advanced semiconductor technology, achieving industry-first innovations such as the world’s first DDR5 DRAM in 2018, the 321-layer NAND Flash in 2024, and the 12-Hi stack HBM4 samples in 2025. The company operates manufacturing sites in Korea, China, the U.S., and Taiwan, along with R&D centers across Asia, Europe, and North America.

In July 2025, SK Hynix announced a USD 6.8 billion investment to build its first semiconductor plant in Yongin, South Korea. The facility will strengthen supply to major clients such as Nvidia, supporting growing global demand for advanced chips.

Main semiconductor products:

• DRAM (desktop, server, laptop, mobile, and graphics DRAM)

• NAND Flash memory (including 321-layer NAND and mobile NAND solutions)

• High Bandwidth Memory (HBM3E, HBM4 samples)

• Solid State Drives (SSDs for data centers and AI PCs)

• CMOS Image Sensors (CIS)

LG Innotek Co., Ltd

LG Innotek Co., Ltd., an affiliate of LG Group, is one of the biggest semiconductor companies in Korea and a leading electronic component manufacturer headquartered in Seoul, South Korea. Established in 1970 as Goldstar Precision, the company has become a key supplier of mobile, automotive, and semiconductor components.

In recent years, LG Innotek has expanded its semiconductor components portfolio, developing technologies like the Cu-Post structure for improved heat dissipation in semiconductor packages, and securing about 40 patents in this field. The company is targeting high-value-added areas such as FC-BGA, RF-SiP, and vehicle application processor (AP) modules, with ambitions to surpass USD 2.2 billion in annual revenue by 2030.

Main semiconductor-related products:

• Camera modules (mobile and automotive, including RGB-IR in-cabin cameras)

• Advanced semiconductor substrates (FC-CSP, FC-BGA, RF-SiP)

• Automotive Application Processor (AP) modules

• LiDAR sensors for Advanced Driver Assistance Systems (ADAS)

• Next-generation digital key solutions

• Eco-friendly magnets (no heavy rare earth elements) for semiconductor and automotive applications

Samsung Electro-Mechanics

Samsung Electro-Mechanics (SEM), a subsidiary of the Samsung Group, is a leading multinational electronic component company headquartered in Suwon, South Korea. Established in 1973 as Samsung Sanyo Parts, the company has evolved into a core part of Samsung’s component ecosystem, specializing in chip parts, semiconductor substrates, camera modules, network modules, and printed circuit boards.

SEM operates on a B2B model, focusing on three key solution areas: components, modules, and substrates. Leveraging expertise in high-frequency wireless materials and power/precision mechanics, SEM continues to expand its role as a global leader in advanced electronic and semiconductor-related components. Its production sites in Sejong and Busan serve as major hubs for manufacturing, ensuring strong supply capabilities to meet global demand.

Production sites in Korea:

• Sejong Plan

• Busan Plant

Main semiconductor-related products:

• MLCCs (Multilayer Ceramic Capacitors)

• Semiconductor substrates (including advanced packaging solutions)

• Camera modules (mobile and automotive)

• Printed circuit boards (PCBs)

• Network modules

Dongjin Semichem

Dongjin Semichem is one of the largest fine chemical and electronic materials manufacturers with a strong presence in the semiconductor industry. The company was founded in 1967 and has grown into a global player with businesses spanning foaming agents, display materials, semiconductor materials, and renewable energy materials.

Dongjin Semichem was the first in Korea and the fourth globally to produce photoresist, marking a breakthrough in reducing Korea’s reliance on imported semiconductor processing materials. Since entering the semiconductor sector in 1984, the company has built a strong portfolio of essential materials, competing with global leaders through continuous innovation and R&D.

Main semiconductor products:

• Photoresist (PR)

• Thinner

• Chemical Mechanical Polishing (CMP) Slurry

• Bottom Anti-reflective Coating (BARC)

• Spin-on-Carbon (SOC) Hardmask

• Precursors

• Melamine Mold Cleaner (MMC)

HANA Micron

Hana Micron Inc. is a fast-growing South Korean semiconductor company specializing in advanced packaging solutions and testing services. The company has built its reputation through innovation in the back-end semiconductor process and strategic partnerships with leading global semiconductor manufacturers.

Hana Micron provides end-to-end services, from wafer bumping and testing to final assembly, packaging, and module manufacturing. By focusing on outsourced semiconductor assembly and test (OSAT), the company supports its customers with world-class backend solutions tailored to meet the evolving demands of high-performance electronics.

Hana Micron is also investing in future growth areas such as vertical-cavity surface-emitting lasers (VCSELs) and medical patches, broadening its technological portfolio beyond traditional semiconductor packaging.

Main semiconductor products & services:

• Semiconductor Back-End Process (OSAT): Assembly, packaging, and test services

• Flip Chip Ball Grid Array (FC-BGA)

• Wafer Level Chip Scale Packaging (WLCSP)

• System-in-Package (SiP)

• Fine Pitch Ball Grid Array (FBGA)

• Lead Frame Packages

• Wafer Test, Final Test, and Engineering Solutions

• Module Assembly & Test

SIMMTECH

SIMMTECH Co., Ltd. is a leading South Korean manufacturer of advanced printed circuit boards (PCBs) and semiconductor packaging substrates. Headquartered in Cheongju, the company has built global competitiveness in high-layer PCBs and is a core supplier to tier-1 semiconductor companies worldwide.

SIMMTECH specializes in module PCBs for memory expansion and substrates for semiconductor chip assembly, both of which are critical for high-performance semiconductor applications. Its BOC boards for DRAM packages and Embedded Trace Substrates have been recognized as "World Class Products" by the Korean government.

Main semiconductor products:

• Memory module PCBs for semiconductor memory expansion

• Substrates for semiconductor chip assembly

• BOC (Board-on-Chip) boards for DRAM packages

• Embedded Trace Substrates (ETS)

DB HiTek Co., Ltd.

DB HiTek Co., Ltd., headquartered in Bucheon, Gyeonggi-do, is South Korea’s second-largest semiconductor foundry after Samsung Electronics. Founded in 1997 as Dongbu Electronics, the company transitioned from memory manufacturing into a foundry business in 2001 and strengthened its position with the acquisition of Anam Semiconductor’s foundry operations in 2002.

Renamed DB HiTek in 2017, the company today operates advanced wafer fabrication facilities that produce system LSI wafers and provide foundry services to global customers. DB HiTek specializes in analog, power management, display driver ICs, contact image sensors, and embedded flash, serving industries such as mobile, computing, automotive, medical, and industrial electronics.

Main semiconductor products & services:

• Power management ICs

• Display Driver ICs

• Contact Image Sensors (CIS)

• Analog and Mixed-Signal chips

• Embedded Flash solutions

• Wafer fabrication (BCD, analog CMOS, HV-CMOS, logic)

Hanmi Semiconductor Co., Ltd.

Hanmi Semiconductor Co., Ltd. is one of the largest semiconductor manufacturing equipment companies in the world, headquartered in Incheon. The company specializes in advanced packaging equipment that enables chip cutting, cleaning, and inspection, and its technologies are used by more than 300 global customers, including ASE, one of the world’s largest chip-packaging companies.

Hanmi also operates a laser division that provides solutions in laser drilling, cutting, ablation, and wafer marking, expanding its footprint in precision semiconductor processing. Hanmi Semiconductor has established itself as a trusted partner in the backend semiconductor supply chain, serving over 320 customers worldwide and driving advancements in semiconductor assembly and packaging technologies.

Main semiconductor equipment & solutions:

• Semiconductor chip cutting, cleaning, and inspection systems

• Advanced packaging equipment for global OSAT companies

• Laser drilling, cutting, ablation, and wafer marking equipment

• Equipment solutions supporting chip assembly and backend processes

Nepes Corp.

Nepes Corporation is a global provider of semiconductor back-end services, specializing in bumping, wafer-level packaging, and testing. Since entering the OSAT business in 2001, the company has partnered with fabless firms and IDMs worldwide, delivering turnkey solutions for both 8-inch and 12-inch wafers.

Its portfolio spans advanced packaging technologies such as system-in-package (SiP) and fan-out panel level packaging (FOPLP), while also extending into materials for semiconductor and display processes, secondary battery components, and smart films.

Nepes operates manufacturing sites in South Korea, the Philippines, and China, supported by sales offices in the United States, China, and Taiwan, strengthening its position as a trusted global OSAT partner.

Main semiconductor products & services:

• Wafer bumping and wafer-level packaging (WLP)

• System-in-Package (SiP) solutions

• Fan-Out Wafer Level Packaging (FOWLP)

• Fan-Out Panel Level Packaging (FOPLP)

• Flip chip bumping and back-end processing

• Semiconductor electrical testing services

Conclusion

South Korea is a global leader in semiconductors with its top companies driving innovation across memory, logic, packaging, materials, and equipment. From giants like Samsung Electronics and SK Hynix to specialized firms such as Hana Micron, SIMMTECH, and Nepes, these businesses form a dynamic ecosystem that powers everything from consumer electronics to data centers and advanced automotive systems.

The rapid adoption of AI has fueled strong demand for High Bandwidth Memory, supporting both chipmakers and equipment providers. The shift toward electric vehicles and advanced driver assistance systems is boosting demand for automotive semiconductors and components, while a rebound in the memory market has renewed momentum for industry leaders.

As these trends accelerate, South Korean semiconductor companies are well-positioned to expand their global footprint and sustain leadership in the next generation of semiconductor innovation.

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